Cpu cooler acc thermal paste/htk-002-u1-gp cooler master

Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. These compounds resist changes in consistency at temperatures up to 177 C (350 F), maintaining a positive heat sink seal to improve heat transfer from the electronic device to the heat sink or chassis, thereby, increasing the overall efficiency of the device.

Suitable for CPU, chipsets on Mainboard, VGA card, etc.

Easy to use

Zif Socket Templates ensure correct applying area with various CPU socket types.

Produces an even layer when using applicator.

Dielectric.

Wide range of application temperature

Thermal Conductivity 0.8 watts/meter-C

Volume Resistivity 5.0 x 1015

Dielectric Constant 4.4 at 100k Hz

Dissipation Factor 0.02 at 100k Hz

Dielectric Strength 550 volts/mil; 21.7 kV/mm

Shelf Life 24 months from DOM